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The thermal expansion coefficient of
single crystal quartz varies with direction, as shown above*. This makes it virtually impossible to avoid
stresses due to thermal expansion coefficient differences - e.g., at interfaces between the quartz
plate and its electrodes and the mounting structure.
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Electrodeless designs, such as the “BVA”
resonator, and the “all quartz package,” attempt to eliminate these stresses
by mounting the quartz resonator plate on a single crystal quartz structure
of the same orientation. However, it
is not the stresses but the changes in the stresses that cause
instabilities, so, in other designs, compliant, spring-like mounting
structures are used to minimize instabilities due to stress relief.
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*Provided by Arthur
Ballato, U.S. Army CECOM, private communication, circa 1978
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R.J. Besson, “A New
Electrodeless Resonator Design,” Proc. 31st Ann. Symp. On Frequency Control,
pp. 147-152, 1977.
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T.E. Parker, J.
Callerame and G.R. Montress, “A New All Quartz Package For SAW Devices,”
Proc. 39th Ann. Symp. on Frequency Control, pp. 519-525, 1985.
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